曲面研磨拋光機型號YH2M81118?主要特點 Technical characters

1.   該設備為八工位Lower plate真空吸附拋光機。工作時，將工件放置在工件盤治具上，利用真空吸附將工件固定在治具上，毛刷盤固定在上盤面，下上盤逆向旋轉，拋光液由噴液管均勻流到Lower plate，利用毛刷、拋光液與玻璃之間的摩擦力實現對玻璃弧面的拋光，其拋光工作流程為：設備就緒-工件盤定位-自動上料-工位盤定位-拋光-完成一次拋光-工位盤定位-自清潔-自動下料-循環(其中，自動上下料-工位盤定位-自清潔與拋光制程可實現不停機循環進行)。

This machine is characterized with 8-station lower plate vacuum absorption polishing machine.Put workpiece on carrier jig, and the workpiece will be fixed on jig by vacuum absorption. The brush plate is fixed on upper plate,which reversely rotates with lower plate,with polishing liquid evenly flowing into the lower plate through spray pipe,making use of the friction between brush,polishing liquid and glass to polish glass camber surface. Polishing process:Machine ready - workpiece plate positioning - auto loading - work station plate positioning - polishing - first time polishing finished - self cleaning - auto unloading - circulation(auto loading/unloading-work station plate positioning - self cleaning and polishing can be proceeded in cycle without stop).

2.  本機下上盤均由數控程序精準定位控制，按工藝要求實現無極調速，以滿足不同拋光工藝要求。八個工件盤由伺服電機控制，實現精準定位。

This machine upper&lower plates’ position are precisely controlled by CNC program, stepless speed governing is realized according to technological requirements,in order to meet different polishing process requirements.8 workpiece plates are controlled by servo-motor with precise positioning。The upper plate is independently driven by variable speed motor.

3.拋光盤的加壓由伺服電機驅動滾珠絲杠在直線導軌上進行位移，精確控制拋光盤上下位移，來保持壓力穩定，確保拋光精度。

4.  本機所有能接觸到拋光液的液槽、箱體面板、接液盆，均采用不銹鋼或鋁合金等耐腐蝕材質。

Anti-corrosion materials such as stainless steel or aluminum alloy are adopted for this machine’s flume,panel,basin which are in contact with polishing liquid.

5.  設備真空系統配置有數顯真空壓力表，實時監控負壓，以防欠壓掉片。

Machine vacuum system is equipped with digital vacuum pressure gauge,real-time monitoring negative pressure,in order to prevent work piece from falling down if pressure is not enough.

6.  設備配置真空氣液分離裝置，自動排液；

Machine is equipped with vacuum air&liquid separating device for automatic draining.

7.  本機采用人機界面HMI(15寸大觸摸屏)與可編程控制PLC相結合，操作方便快捷，界面友好，信息量大。

This machine adopts HMI(15Inch touch screen)with PLC,operation is convenient and efficient with friendly interface and huge amount of information.

項目Item

產品型號Model

單位

Unit

YH2M81118

Lower plate尺寸（外徑×厚度）

Lower plate size(OD×Thickness)

mm

φ400mm×25mm（鋁合金）

φ400mm×25mm(Aluminum alloy)

上盤尺寸（外徑）

Upper plate size(OD)

mm

φ1160mm

拋光頭數量

Number of polishing head

個

8

Lower plate轉速

Lower plate speed

rpm

2～45±2 rpm

上盤轉速

Upper plate speed

rpm

5～90±2 rpm

Z軸快移速度 Z axis movement speed

min

0~2.5m/min

Z軸行程 Z axis travel

mm

350mm

機床外形尺寸（長×寬×高）

Overall dimensions(L*W*H)

mm

2430*1935*2575mm

整機重量

Total weight

Kg

4050Kg